It is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy rods for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy rod
Types
|
Cu
|
Mo
|
Impurities
|
MoCu10
|
10+/-2
|
Base
|
≤0.1
|
MoCu15
|
15+/-3
|
Base
|
≤0.1
|
MoCu20
|
20+/-3
|
Base
|
≤0.1
|
MoCu25
|
25+/-3
|
Base
|
≤0.1
|
MoCu40
|
40+/-5
|
Base
|
≤0.1
|
Advantages:
1. 40% higher than similar tungsten-copper composites.
2. Maximum thermal conductivity
3. Thermal performance and mechanical properties
4. Thermal expansion
5. No need for expensive molds
6. High-precision parts processing
7. Electroplating and metal options
8. Sealing