Molybdenum Copper Rod

It is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy rods for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy rod

It is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy rods for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy rod

 

Types

Cu

Mo

Impurities

MoCu10

10+/-2

Base

≤0.1

MoCu15

15+/-3

Base

≤0.1

MoCu20

20+/-3

Base

≤0.1

MoCu25

25+/-3

Base

≤0.1

MoCu40

40+/-5

Base

≤0.1

 

Advantages:

1. 40% higher than similar tungsten-copper composites.

2. Maximum thermal conductivity

3. Thermal performance and mechanical properties

4. Thermal expansion

5. No need for expensive molds

6. High-precision parts processing

7. Electroplating and metal options

8. Sealing