Molybdenum Copper Heat sink

Molybdenum-copper alloy heat sink used in?electronic sealing , similar to tungsten-copper alloy, also has compositional adjustability to have adjustable thermal conductivity and thermal expansion coefficient.

Product introduction:
- Molybdenum-copper alloy heat sink used in electronic sealing , similar to tungsten-copper alloy, also has compositional adjustability to have adjustable thermal conductivity and thermal expansion coefficient.

- Molybdenum-copper alloys have a lower density than tungsten-copper alloys but a higher coefficient of thermal expansion.

 

Type

Mo Wt%

Cu Wt%

g/cm3

W/(M.K)


(10-6/K)

Mo85Cu15

85± 1

Balance

10

160 - 180

6.8

Mo80Cu20

80 ± 1

Balance

9.9

170 - 190

7.7

Mo70Cu30

70 ± 1

Balance

9.8

180 - 200

9.1

Mo60Cu40

60 ± 1

Balance

9.66

210 - 250

10.3

Mo50Cu50

50 ±0.2

Balance

9.54

230 - 270

11.5

 

Application:

High-power devices such as microwave, laser, radio frequency, optical communication, high-performance lead frames; thermal control boards and heat sinks for military and civilian thermal control devices.