Molybdenum Copper Heat sink
Molybdenum-copper alloy heat sink used in?electronic sealing , similar to tungsten-copper alloy, also has compositional adjustability to have adjustable thermal conductivity and thermal expansion coefficient.
Molybdenum-copper alloy heat sink used in?electronic sealing , similar to tungsten-copper alloy, also has compositional adjustability to have adjustable thermal conductivity and thermal expansion coefficient.
Product introduction:
- Molybdenum-copper alloy heat sink used in electronic sealing , similar to tungsten-copper alloy, also has compositional adjustability to have adjustable thermal conductivity and thermal expansion coefficient.
- Molybdenum-copper alloys have a lower density than tungsten-copper alloys but a higher coefficient of thermal expansion.
Type |
Mo Wt% |
Cu Wt% |
g/cm3 |
W/(M.K) |
|
Mo85Cu15 |
85± 1 |
Balance |
10 |
160 - 180 |
6.8 |
Mo80Cu20 |
80 ± 1 |
Balance |
9.9 |
170 - 190 |
7.7 |
Mo70Cu30 |
70 ± 1 |
Balance |
9.8 |
180 - 200 |
9.1 |
Mo60Cu40 |
60 ± 1 |
Balance |
9.66 |
210 - 250 |
10.3 |
Mo50Cu50 |
50 ±0.2 |
Balance |
9.54 |
230 - 270 |
11.5 |
Application:
High-power devices such as microwave, laser, radio frequency, optical communication, high-performance lead frames; thermal control boards and heat sinks for military and civilian thermal control devices.