Molybdenum Copper Plate

Molybdenum Copper Plates can be processed with the content (Mo85Cu15 , Mo80Cu20 , Mo70Cu30 , Mo60Cu40 , Mo50Cu50) MoCu 85/15 Molybdenum-Copper Composite Material , MoCu 70/30 Molybdenum-Copper Composite Material , MoCu 65/35 Molybdenum-Copper Composite Material , Molybdenum-Copper Composite AMC 7525

Molybdenum Copper Plate is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy sheets for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy plate

 

Type Mo Wt% Cu Wt% g/cm3 W/(M.K)
(10-6/K)
Mo85Cu15 85± 1 Balance 10 160 - 180 6.8
Mo80Cu20 80 ± 1 Balance 9.9 170 - 190 7.7
Mo70Cu30 70 ± 1 Balance 9.8 180 - 200 9.1
Mo60Cu40 60 ± 1 Balance 9.66 210 - 250 10.3
Mo50Cu50 50 ±0.2 Balance 9.54 230 - 270 11.5

 


 

Material Notes: Characteristics:
  • High thermal conductivity
  • Low thermal expansion
  • Low density
Applications:
  • Electronic components - passive cooling elements
  • Automotive industry - carrier plates for IGBT modules in electric drives