Molybdenum Copper Plate is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy sheets for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy plate
Type |
Mo Wt% |
Cu Wt% |
g/cm3 |
W/(M.K) |
(10-6/K) |
Mo85Cu15 |
85± 1 |
Balance |
10 |
160 - 180 |
6.8 |
Mo80Cu20 |
80 ± 1 |
Balance |
9.9 |
170 - 190 |
7.7 |
Mo70Cu30 |
70 ± 1 |
Balance |
9.8 |
180 - 200 |
9.1 |
Mo60Cu40 |
60 ± 1 |
Balance |
9.66 |
210 - 250 |
10.3 |
Mo50Cu50 |
50 ±0.2 |
Balance |
9.54 |
230 - 270 |
11.5 |
Material Notes: |
Characteristics:
- High thermal conductivity
- Low thermal expansion
- Low density
Applications:
- Electronic components - passive cooling elements
- Automotive industry - carrier plates for IGBT modules in electric drives
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