Tungsten Copper Heat Sinks are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc. Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts,
Product introduction:
- Electronic packaging refers to the outer casing of an integrated circuit chip, passive components, the production of a circuit card and the production of the final product or system enclosure. Packaging is an important protection for environmental factors such as moisture, pollution, hazardous chemicals, radiation signals, power transmission, heat dissipation, and electromagnetic interference shielding.
- Heat dissipation in micropower electronics and circuits is an inevitable by-product. The heat sink helps dissipate heat and transfer it to the surrounding air. The design of the heat sink shape also increases its area of contact with the surrounding cooling air.
- Tungsten copper alloy is one of the most popular refractory metal heat sink materials. It is made by vacuum infiltrating molten copper into a hollow tungsten skeleton. By adjusting the content of tungsten, materials having a coefficient of thermal expansion (CTE) matching their coefficients such as ceramics (alumina, yttria), semiconductors (silicon), and metals (Kovar alloy) are designed.
| Type | Tungsten Wt% | Copper Wt% | Density g/cm3 | thermal conductivity W/(M.K) | thermal expansivity (10-6/K) |
| W90Cu10 | 90 ± 1 | Base | 17.0 | 180 - 190 | 6.5 |
| W85Cu15 | 85 ± 1 | Base | 16.4 | 190 - 200 | 7.0 |
| W80Cu20 | 80 ± 1 | Base | 15.6 | 200 - 210 | 8.3 |
| W75Cu25 | 75 ± 1 | Base | 14.9 | 220 - 230 | 9.0 |
| W50Cu50 | 50 ± 1 | Base | 12.2 | 310 - 340 | 12.5 |
Advantages
